As the industrial sector seeks to develop smaller and smaller products, electronic miniaturisation is a key challenge for companies such as LACROIX Electronics. In-line fitting technologies for surface-mounted components are at the cutting edge, but fitting precision can be difficult to maintain when it comes to components barely visible to the naked eye. This is where our partner Essemtec comes in, with its Spider platform for applying droplets of glue to hold miniature components in place.
Using the innovative technology known as jetting, the robot performs a rapid and ultra-precise mechanical action, which projects drops of glue via a syringe. The application of these very small drops of glue supports the components as they pass through the reflow oven in order to retain their fitting precision. This therefore enables LACROIX Electronics to ensure consistent control over the manipulation of fluid materials and to enhance precision for the fitting of miniature components. The company thus achieves the performance required for microelectronics.
Tried and tested for the needs of our automotive customers, we also wish to offer this technological advance to our industrial customers and to the IIOT sector, where there is a demand for robust miniaturisation
Furthermore, the value created by industrial IoT items comes directly from the sensors, so it is important that these are perfectly fitted in order to record the required data in optimal fashion.
Following a training course given by Essemtec, LACROIX Electronics can now easily create programs to connect the machine to the entire digital chain system. Interconnecting production systems in this way enables the establishment of a continuous link between data related to design, manufacture, inspection and testing.
So this is only the beginning for this technology, which has a bright future at LACROIX Electronics!
“Validated by our Polish factory, the aim is to develop this technology throughout the company’s other production plants, firstly in Tunisia, then within the future electronics factory, “Symbiose”, which is set to open in 2021 in France,”
Benjamin Gauchenot, VP Operations & Quality at LACROIX Electronics’.
“This is an extremely efficient high-precision machine. After the first uses, we can now easily double our drops of glue per hour capacity and meet the quality requirements of our customers.”
Andrzej Wróblewski, Process Engineering Manager at LACROIX Electronics Poland,
“The glue application solution provided by Essemtec and its partner SEICA has successfully met the technological challenges set by LACROIX Electronics. The teams worked together on Essemtec’s Spider platform. They adopted a collaborative approach, oriented at all times towards the resolution of technical issues. We demonstrated our abilities to address the challenges faced by LACROIX Electronics, a key player in Europe, and we want to thank LACROIX Electronics for recognising the effectiveness of our technical solution.”
Franck Genonceau, French Market Commercial Affairs Officer at Essemtec’s.