LACROIX Electronics offers a complete assembly service:
Assembly of all types of SMT packages, including Fine Pitch BGA/CSP (0.4 mm), QFN, LGA, 0201
Assembly of thick, large, flex and rigid flex boards
Wave soldering and selective wave soldering (with and without lead), with the latter being suitable for high density design
Repair station for insertion of mount components and high density SMT
Assembly of press-fit connectors
- Cables, re-wiring, box assembly
A Technology Road Map is maintained regularly to meet future client requirements (high density assembly, new technologies).