LACROIX Electronics offers a complete assembly service:

  • Assembly of all types of SMT packages, including Fine Pitch BGA/CSP (0.4 mm), QFN, LGA, 0201
  • Assembly of thick, large, flex and rigid flex boards
  • Wave soldering and selective wave soldering (with and without lead), with the latter being suitable for high density design
  • Repair station for insertion of mount components and high density SMT
  • Assembly of press-fit connectors
  • Cables, re-wiring, box assembly

A Technology Road Map is maintained regularly to meet future client requirements (high density assembly, new technologies).